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ADHESION & BONDING EXPO - OSAKA
12 May 2027 · Osaka, Japan
Human Verified
Event details reviewed by the Koodledo editorial team. Last verified 7 November 2026.
International trade fair for adhesive and joining technologies, covering joining equipment and bonding technologies. Once a year; listed duration 3 days. Venue: Intex Osaka.
Koodledo does not sell tickets. Booking and prices are handled by the organiser.
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